Nova Series Air Cooler

NT620

NOVA NT620 LCP PRO BK

A flagship twin-tower air cooler with six 6 mm heatpipes, a blacked-out fin stack, and two R25 LCP PRO 120 mm fans built for high-load desktop processors.

280WCooling Class
6 x 6 mmHeatpipes
2 x R25Fans
158.5 mmHeight

Flagship air cooling, built around real thermal mass. Dual towers. Dual R25 LCP PRO fans. Six heatpipes.

Thermal Architecture

Designed for sustained high-wattage CPU loads.

NT620 combines dense black fin stacks, bidirectional heatpipe behavior, and high-pressure R25 airflow to move heat out of the socket area with control.
NT620 black twin-tower fin stack

Twin-Tower Structure

Two dense fin stacks for high thermal capacity.

The dual-tower layout expands heat-dissipation area while keeping airflow paths direct through each fin stack for modern high-core-count CPUs.
NT620 six heatpipe base structure

6 x 6 mm Heatpipes

Bidirectional heat transfer from the copper base.

Six black-coated heatpipes draw heat from the CPU contact area and distribute it into both towers for lower resistance under broad input loads.
NT620 with R25 LCP PRO fan

Dual R25 LCP PRO Fans

Flagship 120 mm airflow from both towers.

Two R25 LCP PRO fans use LCP blades, dual ball bearings, and three PWM profiles to balance high static pressure, airflow, and acoustic control.
Turbo3000 RPM +/-10%
Airflow
131.32 CFM
Pressure
6.55 mm-H2O
Noise
45.56 dBA
Performance2400 RPM +/-10%
Airflow
104.54 CFM
Pressure
4.64 mm-H2O
Noise
39.81 dBA
Hybrid1600 RPM +/-10%
Airflow
70.38 CFM
Pressure
2.15 mm-H2O
Noise
29.6 dBA

Three PWM Profiles

Select the output that fits the thermal load.

Turbo pushes maximum heat removal, Performance balances speed and acoustics, while Hybrid keeps daily loads controlled at a quieter operating point.
NT620 fin insertion structure

Fin Insertion Process

Through-fin and folded-fin reinforcement.

The fin stack uses a through-fin plus folded-fin process to tighten heatpipe contact, improve structural strength, and increase usable dissipation area.
NT620 mounting base and heatpipe contact area

Anti-bending

High strength bending resistance.

Prevent product deformation caused by long-distance transportation and deformation caused by gravity for a long time when the machine is installed horizontally.
NT620 multi-platform backplate

Platform Support

Intel and AMD mounting with a simplified backplate.

NT620 supports Intel LGA 115x / 1200 / 1700 / 1851 and AMD AM4 / AM5, with a multi-platform backplate designed to make installation cleaner.

Technical Data

NT620 specification overview.

Model
NOVA NT620 LCP PRO BK
CPU Support
Intel LGA 115x / 1200 / 1700 / 1851, AMD AM4 / AM5
Cooler Dimensions
136 x 125 x 158.5 mm
Fin Thickness
0.35 mm
Heatpipe Specification
6 mm x 6 heatpipes
Structure
Twin tower, black-coated fins and heatpipes
Fan Size
120 x 120 x 25 mm
Fan Quantity
2
Fan Bearing
Dual ball bearing
Speed
3000 / 2400 / 1600 RPM, +/-10%
Airflow
131.32 / 104.54 / 70.38 CFM
Static Pressure
6.55 / 4.64 / 2.15 mm-H2O
Noise
45.56 / 39.81 / 29.6 dBA
Rated Voltage
12V
Current
490 mA
Power
5.88W
Fan Connector
4-pin PWM
Warranty
5 years